{"title":"新兴的可重构系统:探索3D FPGA架构","authors":"K. Salah, Mohamed Abdelsalam","doi":"10.1109/ICM.2013.6734947","DOIUrl":null,"url":null,"abstract":"Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.","PeriodicalId":372346,"journal":{"name":"2013 25th International Conference on Microelectronics (ICM)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Emerging reconfigurable systems: Exploring 3D FPGA architectures\",\"authors\":\"K. Salah, Mohamed Abdelsalam\",\"doi\":\"10.1109/ICM.2013.6734947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.\",\"PeriodicalId\":372346,\"journal\":{\"name\":\"2013 25th International Conference on Microelectronics (ICM)\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 25th International Conference on Microelectronics (ICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICM.2013.6734947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 25th International Conference on Microelectronics (ICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM.2013.6734947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Emerging reconfigurable systems: Exploring 3D FPGA architectures
Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.