{"title":"表面贴装DC-DC转换器的设计注意事项","authors":"S. O’Driscoll, B. McDermott","doi":"10.1109/APEC.1999.749668","DOIUrl":null,"url":null,"abstract":"The key contender packaging systems for high specification surface mountable (SMT) DC-DC power converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. Thermal performance comparison data are presented. Mechanical performance criteria, evaluating the power converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.","PeriodicalId":287192,"journal":{"name":"APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)","volume":"280 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design considerations for surface mountable DC-DC converters\",\"authors\":\"S. O’Driscoll, B. McDermott\",\"doi\":\"10.1109/APEC.1999.749668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The key contender packaging systems for high specification surface mountable (SMT) DC-DC power converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. Thermal performance comparison data are presented. Mechanical performance criteria, evaluating the power converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.\",\"PeriodicalId\":287192,\"journal\":{\"name\":\"APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)\",\"volume\":\"280 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC.1999.749668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.1999.749668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design considerations for surface mountable DC-DC converters
The key contender packaging systems for high specification surface mountable (SMT) DC-DC power converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. Thermal performance comparison data are presented. Mechanical performance criteria, evaluating the power converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.
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