低温封装方法是微系统组装和集成的关键推动因素

2018 International Semiconductor Conference (CAS) Pub Date : 2018-10-01 DOI:10.1109/SMICND.2018.8539847

S. Stoukatch, F. Dupont, M. Kraft

{"title":"低温封装方法是微系统组装和集成的关键推动因素","authors":"S. Stoukatch, F. Dupont, M. Kraft","doi":"10.1109/SMICND.2018.8539847","DOIUrl":null,"url":null,"abstract":"The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Low-Temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration\",\"authors\":\"S. Stoukatch, F. Dupont, M. Kraft\",\"doi\":\"10.1109/SMICND.2018.8539847\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.\",\"PeriodicalId\":247062,\"journal\":{\"name\":\"2018 International Semiconductor Conference (CAS)\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Semiconductor Conference (CAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2018.8539847\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Semiconductor Conference (CAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2018.8539847","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

本文报道了如何将微系统组装和集成为全功能系统。我们表明，在集成电路常用的各种装配技术和方法中，有些也可以成功地用于微系统的装配。MS对组装和集成过程中可能发生的热暴露特别敏感。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Low-Temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration

The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2018 International Semiconductor Conference (CAS)

自引率

0.00%

发文量

期刊最新文献

Effect of the Deposition Conditions on Titanium Oxide Thin Films Properties Semiconductor Devices and Microsystems (Poster Session) TiO2 - Graphene Oxide Thin Films Obtained by Spray Pyrolysis Deposition LDO with a Dual Complementary Buffer Architecture GeSi Nanocrystals in SiO2 Matrix with Extended Photoresponse in Near Infrared