盖子粘接失效的根本原因研究

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507812

M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master

{"title":"盖子粘接失效的根本原因研究","authors":"M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master","doi":"10.1109/IEMT.2008.5507812","DOIUrl":null,"url":null,"abstract":"This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Root cause study on lid adhesion failure\",\"authors\":\"M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master\",\"doi\":\"10.1109/IEMT.2008.5507812\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.\",\"PeriodicalId\":151085,\"journal\":{\"name\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2008.5507812\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2008.5507812","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文研究了引起盖子与胶粘剂粘结失效的因素。结合FTIR和XPS对盖子表面行为的分析，对胶粘剂的固化机理进行了实验研究。结果表明，低水洗流量造成的杯盖表面残留会影响固化条件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Root cause study on lid adhesion failure

This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

自引率

0.00%

发文量