毫米波印刷电路板的发展。机械封装和电气要求的改进

H. Hai, J.C. Frankosky, R. R. Hornung, M.T. Smith
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引用次数: 1

摘要

毫米应用对用作传输线或天线的电路板层压板提出了更高和独特的要求。从历史上看,应用程序的容量很小。材料要么来自标准或半标准产品,这些产品不适合毫米波,要么是军用级的材料。最近毫米应用的增长,如ACC(自适应巡航控制)和用于标准、大批量、价格合理的车辆或商用毫米通信系统的侧变道传感器,推动了电路板层压板制造商创新材料。本文探讨了毫米波电路板的发展和对材料的技术要求。
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Millimeter Wave Printed Circuit Board Developments - Improvements for Mechanical Packaging and Electrical Requirements
Millimeter applications place heightened and unique requirements on circuit board laminates used as transmission lines or as antennas. Historically, applications were low volume. Materials were either adapted from standard or semi-standard products that were not ideal for millimeter wave or the materials that were military grade in nature. Recent growth of millimeter applications, such as ACC (adaptive cruise control) and side lane changing sensors for standard, high volume, affordably priced vehicles or commercial millimeter communication systems, has driven circuit board laminate fabricators to innovate materials. This paper explores advancements in millimeter wave circuit boards and the technical requirements placed on materials.
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