{"title":"采用硅技术的低成本相控阵的进展","authors":"Gabriel M. Rebeiz, L. Paulsen","doi":"10.1109/APUSNCURSINRSM.2017.8072560","DOIUrl":null,"url":null,"abstract":"This paper presents phased-array efforts at X to Ka-band based on highly-integrated silicon core chips. The work shows that it is possible to build advanced phased-arrays using SiGe chips at each antenna element. The phased-array is constructed on a single printed-circuit board which reduces the cost by a factor of 10x. This will revolutionize X, Ku and Ka-band phased arrays by making them the preferred choice for 5G, SATCOM and point-to-point applications.","PeriodicalId":264754,"journal":{"name":"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Advances in low-cost phased arrays using silicon technologies\",\"authors\":\"Gabriel M. Rebeiz, L. Paulsen\",\"doi\":\"10.1109/APUSNCURSINRSM.2017.8072560\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents phased-array efforts at X to Ka-band based on highly-integrated silicon core chips. The work shows that it is possible to build advanced phased-arrays using SiGe chips at each antenna element. The phased-array is constructed on a single printed-circuit board which reduces the cost by a factor of 10x. This will revolutionize X, Ku and Ka-band phased arrays by making them the preferred choice for 5G, SATCOM and point-to-point applications.\",\"PeriodicalId\":264754,\"journal\":{\"name\":\"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APUSNCURSINRSM.2017.8072560\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APUSNCURSINRSM.2017.8072560","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advances in low-cost phased arrays using silicon technologies
This paper presents phased-array efforts at X to Ka-band based on highly-integrated silicon core chips. The work shows that it is possible to build advanced phased-arrays using SiGe chips at each antenna element. The phased-array is constructed on a single printed-circuit board which reduces the cost by a factor of 10x. This will revolutionize X, Ku and Ka-band phased arrays by making them the preferred choice for 5G, SATCOM and point-to-point applications.
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