{"title":"高压pm注入SiGe HBT的电热分析","authors":"Zhen Lu, Liang Zhou, Xiaofeng Hu","doi":"10.1109/NEMO49486.2020.9343573","DOIUrl":null,"url":null,"abstract":"In this paper, the failure of SiGe HBT is analyzed under high power microwave pulses. The transient simulation is conducted to obtain the temperature distributions and change of junction temperature with pulse injected. The calculated failure results are compared with measurement results which show close agreements.","PeriodicalId":305562,"journal":{"name":"2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electro-Thermal analysis of SiGe HBT under HPM Injection\",\"authors\":\"Zhen Lu, Liang Zhou, Xiaofeng Hu\",\"doi\":\"10.1109/NEMO49486.2020.9343573\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the failure of SiGe HBT is analyzed under high power microwave pulses. The transient simulation is conducted to obtain the temperature distributions and change of junction temperature with pulse injected. The calculated failure results are compared with measurement results which show close agreements.\",\"PeriodicalId\":305562,\"journal\":{\"name\":\"2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NEMO49486.2020.9343573\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMO49486.2020.9343573","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文分析了SiGe HBT在高功率微波脉冲作用下的失效。通过瞬态仿真得到了脉冲注入后的温度分布和结温变化情况。计算结果与实测结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Electro-Thermal analysis of SiGe HBT under HPM Injection
In this paper, the failure of SiGe HBT is analyzed under high power microwave pulses. The transient simulation is conducted to obtain the temperature distributions and change of junction temperature with pulse injected. The calculated failure results are compared with measurement results which show close agreements.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A Wideband Millimeter Wave E-shape Antenna in Package with Embedded Wafer Level Ball Grid Array Technology Mechanical and Electromagnetic Analysis of Flexible Fractal Interconnect Structures under High Frequency An Artificial Neural Network Based Design of Triple-Band Microstrip Patch Antenna for WLAN Applications A Regularization Scheme Based on Gaussian Mixture Model for EM Data Inversion Design of a Circularly Polarized Metasurface Antenna with Characteristic Mode Theory
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1