{"title":"在MCM-D上带自动粘合芯片","authors":"T. Chung, J. Chang, A. Emamjomeh","doi":"10.1109/IEMT.1993.398190","DOIUrl":null,"url":null,"abstract":"Tape automated bonding (TAB) is an integrated circuit (IC) chip-level interconnect technology. An in-depth overview of TAB chip on board technology and related applications is presented. Key considerations of design, materials, assembly, and equipment for TAB chip on multichip module (MCM)-D are discussed in detail. The issues, pros and cons, problems and solutions, and guidelines are provided to examine a variety of applications. Examples of both face-up and flipped TAB chip on MCM-D applications are presented and discussed. Future trends of TAB technology are also discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Tape automated bonded chip on MCM-D\",\"authors\":\"T. Chung, J. Chang, A. Emamjomeh\",\"doi\":\"10.1109/IEMT.1993.398190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Tape automated bonding (TAB) is an integrated circuit (IC) chip-level interconnect technology. An in-depth overview of TAB chip on board technology and related applications is presented. Key considerations of design, materials, assembly, and equipment for TAB chip on multichip module (MCM)-D are discussed in detail. The issues, pros and cons, problems and solutions, and guidelines are provided to examine a variety of applications. Examples of both face-up and flipped TAB chip on MCM-D applications are presented and discussed. Future trends of TAB technology are also discussed.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Tape automated bonding (TAB) is an integrated circuit (IC) chip-level interconnect technology. An in-depth overview of TAB chip on board technology and related applications is presented. Key considerations of design, materials, assembly, and equipment for TAB chip on multichip module (MCM)-D are discussed in detail. The issues, pros and cons, problems and solutions, and guidelines are provided to examine a variety of applications. Examples of both face-up and flipped TAB chip on MCM-D applications are presented and discussed. Future trends of TAB technology are also discussed.<>
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