2T-FNFN器件结构嵌入式快闪存储器程序/擦除持久性温度依赖性实验研究

G. Tao, H. Chauveau, S. Nath
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引用次数: 2

摘要

到目前为止,大多数闪存耐用性的测试结果通常在-40摄氏度到+85摄氏度的温度范围内,而汽车“引擎盖下”应用中的器件可以承受高达150摄氏度的温度。本文报道了基于FN/FN的闪存的温度依赖性。在2.7Mb的测试存储器阵列上进行了实验,温度高达150℃。已经开发了一个经验模型来描述Vt窗的温度依赖性退化。该模型与整个温度范围内的实验数据拟合良好,单次P/E循环的续航性能超过100万次
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Experimental Study of Temperature Dependence of Program/Erase Endurance of Embedded Flash Memories with 2T-FNFN Device Architecture
Most of the flash endurance results reported so far are typically in a temperature range of -40degC to +85degC, while devices in automotive "under the hood" applications can experience up to 150degC. This paper reports the temperature dependence of FN/FN based flash memories. Experiments have been carried out on 2.7Mb test memory arrays with temperatures up to 150degC. An empirical model has been developed to describe the temperature dependent degradation of the Vt window. This model fits the experimental data over the whole temperature range, and the endurance performance with single shot P/E cycles exceeds 1 million cycles
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