{"title":"三维微电子:教学经验和研究前景广阔的领域","authors":"A. M'zah, O. Hammami","doi":"10.1109/ICEELI.2012.6360580","DOIUrl":null,"url":null,"abstract":"3D Design is not really a new technology; in fact the first ASIC design was designed in 1986. These last years, the interest in 3D is emerging to deal with the problem of the interconnect delay which is overcoming the gates delay in nanometer technologies. 3D ASIC design is facing industrial and academic challenges. We present in this work, the description of a 3D ASIC designs practical work teaching to students applying to the Master degree.","PeriodicalId":398065,"journal":{"name":"International Conference on Education and e-Learning Innovations","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"3D microelectronics: Teaching experience and research promising field\",\"authors\":\"A. M'zah, O. Hammami\",\"doi\":\"10.1109/ICEELI.2012.6360580\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"3D Design is not really a new technology; in fact the first ASIC design was designed in 1986. These last years, the interest in 3D is emerging to deal with the problem of the interconnect delay which is overcoming the gates delay in nanometer technologies. 3D ASIC design is facing industrial and academic challenges. We present in this work, the description of a 3D ASIC designs practical work teaching to students applying to the Master degree.\",\"PeriodicalId\":398065,\"journal\":{\"name\":\"International Conference on Education and e-Learning Innovations\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Education and e-Learning Innovations\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEELI.2012.6360580\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Education and e-Learning Innovations","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEELI.2012.6360580","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D microelectronics: Teaching experience and research promising field
3D Design is not really a new technology; in fact the first ASIC design was designed in 1986. These last years, the interest in 3D is emerging to deal with the problem of the interconnect delay which is overcoming the gates delay in nanometer technologies. 3D ASIC design is facing industrial and academic challenges. We present in this work, the description of a 3D ASIC designs practical work teaching to students applying to the Master degree.
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