K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, E. Seok, J. Brewer, Li Gao, A. Sugavanam, Jau-Jr Lin, Y. Su, C. Cao, M. Hwang, Yanping Ding, Zhenbiao Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang
{"title":"集成天线的硅集成电路","authors":"K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, E. Seok, J. Brewer, Li Gao, A. Sugavanam, Jau-Jr Lin, Y. Su, C. Cao, M. Hwang, Yanping Ding, Zhenbiao Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang","doi":"10.1109/CICC.2006.320824","DOIUrl":null,"url":null,"abstract":"The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing","PeriodicalId":269854,"journal":{"name":"IEEE Custom Integrated Circuits Conference 2006","volume":"78 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Silicon Integrated Circuits Incorporating Antennas\",\"authors\":\"K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, E. Seok, J. Brewer, Li Gao, A. Sugavanam, Jau-Jr Lin, Y. Su, C. Cao, M. Hwang, Yanping Ding, Zhenbiao Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang\",\"doi\":\"10.1109/CICC.2006.320824\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing\",\"PeriodicalId\":269854,\"journal\":{\"name\":\"IEEE Custom Integrated Circuits Conference 2006\",\"volume\":\"78 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Custom Integrated Circuits Conference 2006\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.2006.320824\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Custom Integrated Circuits Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2006.320824","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
