{"title":"杂化微电路中微weids对腐蚀降解的敏感性","authors":"J. Jellison","doi":"10.1109/IRPS.1975.362678","DOIUrl":null,"url":null,"abstract":"Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.","PeriodicalId":369161,"journal":{"name":"13th International Reliability Physics Symposium","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1975-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Susceptibility of Microweids in Hybrid Microcincuits to Corrosion Degradation\",\"authors\":\"J. Jellison\",\"doi\":\"10.1109/IRPS.1975.362678\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.\",\"PeriodicalId\":369161,\"journal\":{\"name\":\"13th International Reliability Physics Symposium\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1975-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"13th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1975.362678\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"13th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1975.362678","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Susceptibility of Microweids in Hybrid Microcincuits to Corrosion Degradation
Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.
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