{"title":"部件和封装结构功能的物理解释和数值近似","authors":"L. Codecasa, D. D’Amore, P. Maffezzoni","doi":"10.1109/STHERM.2005.1412171","DOIUrl":null,"url":null,"abstract":"A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"133 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Physical interpretation and numerical approximation of structure functions of components and packages\",\"authors\":\"L. Codecasa, D. D’Amore, P. Maffezzoni\",\"doi\":\"10.1109/STHERM.2005.1412171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"133 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Physical interpretation and numerical approximation of structure functions of components and packages
A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.
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