{"title":"电信设备的热设计与验证","authors":"Jongsu Park, Y. Park, Yong Kim","doi":"10.1109/STHERM.2005.1412180","DOIUrl":null,"url":null,"abstract":"Telecommunication equipments are so complex and the components involve so wide range of physical lengths that it is almost impossible to simulate the convection heat transfer of the whole device. Therefore, we performed two-level modeling, system-level analysis and board-level analysis. The two analyses are coupled to each other as a boundary condition in terms of velocity and pressure. We performed board-level and system-level experiments and verified the proposed model.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal design and verification of telecommunication equipment\",\"authors\":\"Jongsu Park, Y. Park, Yong Kim\",\"doi\":\"10.1109/STHERM.2005.1412180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Telecommunication equipments are so complex and the components involve so wide range of physical lengths that it is almost impossible to simulate the convection heat transfer of the whole device. Therefore, we performed two-level modeling, system-level analysis and board-level analysis. The two analyses are coupled to each other as a boundary condition in terms of velocity and pressure. We performed board-level and system-level experiments and verified the proposed model.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412180\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412180","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal design and verification of telecommunication equipment
Telecommunication equipments are so complex and the components involve so wide range of physical lengths that it is almost impossible to simulate the convection heat transfer of the whole device. Therefore, we performed two-level modeling, system-level analysis and board-level analysis. The two analyses are coupled to each other as a boundary condition in terms of velocity and pressure. We performed board-level and system-level experiments and verified the proposed model.
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