Kaixue Ma, K. Yeo, Shouxian Mou, N. Mahalingam, Yisheng Wang, Bharatha Kumar Thangarasu, Jinna Yan, Wanxin Ye, Keping Wang, W. M. Lim, T. S. Wong, Yang Lu, Wanlan Yang, Khiam-Boon Png, F. Chin, Xiaoming Peng, Albert Chai, Z. Guoping, C. Yoong, Yin Jee Khoi, Z. Weiqiang, Qu Xuhong, Law Sie Yong, Zhao Cheng, C. Simon, Cheng Wang Cho, J.C. Bo, X. Qing, Zhining Chen
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引用次数: 1
摘要
本文提出了基于IEEE 802.11ad标准的双芯片无线通信解决方案。该解决方案基于嵌入USB3.0接口的全集成基带IC (BBIC)和嵌入封装系统天线内的低功耗60 GHz收发器SOC (RFIC)。BBIC采用频域均衡器和前置电路来实现同步、自动增益控制、估计和补偿，以提高系统性能。基于低成本SiGe 0.18 um BiCMOS工艺，完全集成了一种采用亚谐波滑动中频方案的低功耗60GHz RFIC。
A fully integrated 60GHz dual-chip wireless solution for IEEE802.11ad applications (Invited)
This paper presents our developed dual-chip wireless communication solution adhering to the IEEE 802.11ad standards. The solution is based on a fully integrated baseband IC (BBIC) embedded with USB3.0 interfaces and a low power 60 GHz transceiver SOC (RFIC) embedded inside an antenna in packaging system. The BBIC uses frequency domain equalizer and preambles to perform synchronization, automatic gain control, estimation and compensation for better system performance. A low power 60GHz RFIC using a sub-harmonic sliding-IF scheme is fully integrated based on low cost SiGe 0.18 um BiCMOS process.
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