在0.13 /spl mu/m CMOS技术下的低温寄生导通

A. Mercha, J. M. Rafí, E. Sirnoen, E. Augendre, C. Claeys
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引用次数: 7

摘要

采用0.13 μm CMOS技术对n-和p- mosfet进行4.2 K和77 K的低温测量。在亚阈值区和4.2 K强反转区确定了两个寄生电流贡献。第一个与浅沟隔离固有的寄生并联传导有关。而导致线性跨导出现第二个峰值的第二个因素,则是由于4.2K时衬底电阻率较高,衬底多数载流子的影响更强。在n- mosfet中测量的衬底电流可能来自于电子从衬底价带隧穿到栅极。在4.2 K时,衬底电流诱导阈值电压降低,导致b(V G)特性的测量扭结和低漏偏置的第二个跨导峰值。
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Parasitic conduction in a 0.13 /spl mu/m CMOS technology at low temperature
Low temperature measurements at 4.2 K and 77 K are performed on n- and p-MOSFETs of a 0.13 μm CMOS technology. Two parasitic current contributions are identified in the subthreshold regime and strong inversion at 4.2 K. The first one is related to a parasitic parallel conduction inherent to Shallow Trench Isolation. Whereas the second one, resulting in a second peak in the linear transconductance, is discussed in terms of a stronger impact of substrate majority carriers due to a higher substrate resistivity at 4.2K. The measured substrate current in n-MOSFETs is probably originating from electrons tunneling from the substrate valence band to the gate. At 4.2 K, the substrate current induces a reduction of the threshold voltage resulting in the measured kink of the b(V G ) characteristic and the second transconductance peak at low drain bias.
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