{"title":"封装上的毫米波FSS集成与3d打印封装","authors":"B. Tehrani, S. A. Nauroze, R. Bahr, M. Tentzeris","doi":"10.1109/APUSNCURSINRSM.2017.8072047","DOIUrl":null,"url":null,"abstract":"This work outlines the design, simulation, and fabrication of a millimeter-wave (mm-wave) frequency selective surface (FSS) integrated directly onto a 3D-printed die encapsulation. The cross-shaped slot FSS is designed to function as a bandpass filter centered at 77 GHz for on-package tunability. Stereolithography (SLA) 3D printing is used to fabricate encapsulations for silicon dies attached to a metallic QFN leadframe. Surface profilometry is used to assess the roughness of the SLA-printed surfaces, yielding roughness 25× lower than standard fused deposition modeling (FDM) 3D printing techniques. Finally, inkjet printing is used in a post-process fashion to fabricate the package-integrated FSS directly onto a 3D-printed die encapsulation as a proof-of-concept demonstration.","PeriodicalId":264754,"journal":{"name":"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"On-package mm-wave FSS integration with 3D-printed encapsulation\",\"authors\":\"B. Tehrani, S. A. Nauroze, R. Bahr, M. Tentzeris\",\"doi\":\"10.1109/APUSNCURSINRSM.2017.8072047\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work outlines the design, simulation, and fabrication of a millimeter-wave (mm-wave) frequency selective surface (FSS) integrated directly onto a 3D-printed die encapsulation. The cross-shaped slot FSS is designed to function as a bandpass filter centered at 77 GHz for on-package tunability. Stereolithography (SLA) 3D printing is used to fabricate encapsulations for silicon dies attached to a metallic QFN leadframe. Surface profilometry is used to assess the roughness of the SLA-printed surfaces, yielding roughness 25× lower than standard fused deposition modeling (FDM) 3D printing techniques. Finally, inkjet printing is used in a post-process fashion to fabricate the package-integrated FSS directly onto a 3D-printed die encapsulation as a proof-of-concept demonstration.\",\"PeriodicalId\":264754,\"journal\":{\"name\":\"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APUSNCURSINRSM.2017.8072047\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APUSNCURSINRSM.2017.8072047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On-package mm-wave FSS integration with 3D-printed encapsulation
This work outlines the design, simulation, and fabrication of a millimeter-wave (mm-wave) frequency selective surface (FSS) integrated directly onto a 3D-printed die encapsulation. The cross-shaped slot FSS is designed to function as a bandpass filter centered at 77 GHz for on-package tunability. Stereolithography (SLA) 3D printing is used to fabricate encapsulations for silicon dies attached to a metallic QFN leadframe. Surface profilometry is used to assess the roughness of the SLA-printed surfaces, yielding roughness 25× lower than standard fused deposition modeling (FDM) 3D printing techniques. Finally, inkjet printing is used in a post-process fashion to fabricate the package-integrated FSS directly onto a 3D-printed die encapsulation as a proof-of-concept demonstration.
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