{"title":"锡铅焊料和溴化阻燃剂替代品的研究","authors":"C. Murphy, G. Pitts","doi":"10.1109/ISEE.2001.924545","DOIUrl":null,"url":null,"abstract":"World-wide interest in alternatives to tin-lead (Sn-Pb) solder and to brominated flame retardants (BFRs) continues to grow, in no small part due to the WEEE (Waste Electrical and Electronic Equipment) Directive in the European Union. While regulatory and market pressures are the primary drivers in the search for alternatives, there are important efforts underway to understand the environmental impacts and performance of these new materials and systems relative to those they are slated to replace. This paper briefly summarizes these alternatives and the data collected to-date, which will lead to an improved understanding of the relative merits and drawbacks of conventional verses emerging technologies. Included are discussions of technical performance, end-of-life issues, and life-cycle analyses. A bibliography of published papers, reports, and web-sites is provided.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Survey of alternatives to tin-lead solder and brominated flame retardants\",\"authors\":\"C. Murphy, G. Pitts\",\"doi\":\"10.1109/ISEE.2001.924545\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"World-wide interest in alternatives to tin-lead (Sn-Pb) solder and to brominated flame retardants (BFRs) continues to grow, in no small part due to the WEEE (Waste Electrical and Electronic Equipment) Directive in the European Union. While regulatory and market pressures are the primary drivers in the search for alternatives, there are important efforts underway to understand the environmental impacts and performance of these new materials and systems relative to those they are slated to replace. This paper briefly summarizes these alternatives and the data collected to-date, which will lead to an improved understanding of the relative merits and drawbacks of conventional verses emerging technologies. Included are discussions of technical performance, end-of-life issues, and life-cycle analyses. A bibliography of published papers, reports, and web-sites is provided.\",\"PeriodicalId\":448468,\"journal\":{\"name\":\"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEE.2001.924545\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEE.2001.924545","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Survey of alternatives to tin-lead solder and brominated flame retardants
World-wide interest in alternatives to tin-lead (Sn-Pb) solder and to brominated flame retardants (BFRs) continues to grow, in no small part due to the WEEE (Waste Electrical and Electronic Equipment) Directive in the European Union. While regulatory and market pressures are the primary drivers in the search for alternatives, there are important efforts underway to understand the environmental impacts and performance of these new materials and systems relative to those they are slated to replace. This paper briefly summarizes these alternatives and the data collected to-date, which will lead to an improved understanding of the relative merits and drawbacks of conventional verses emerging technologies. Included are discussions of technical performance, end-of-life issues, and life-cycle analyses. A bibliography of published papers, reports, and web-sites is provided.