{"title":"高温时效下Zn在Sn-Zn基焊点中的原子扩散","authors":"Jian-Chun Liu, Long Xiao, Z. Yue, Gong Zhang","doi":"10.1109/EDAPS.2017.8277008","DOIUrl":null,"url":null,"abstract":"The diffusion behavior of Zn in Sn-8Zn-3Bi solder joints was investigated during long-time aging at 160 °C. Intermetallic compounds (IMCs) were formed at the interface, which were identified as Ni-Zn. Thickness of the IMCs layer increased whereas the growth rate decreased with time. It was found that the growth kinetic of the IMCs was diffusion control. A diffusion model was thus proposed to describe the diffusion behavior of Zn during long-term aging, which appeared to provide a good agreement with the microstructure evolution.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging\",\"authors\":\"Jian-Chun Liu, Long Xiao, Z. Yue, Gong Zhang\",\"doi\":\"10.1109/EDAPS.2017.8277008\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The diffusion behavior of Zn in Sn-8Zn-3Bi solder joints was investigated during long-time aging at 160 °C. Intermetallic compounds (IMCs) were formed at the interface, which were identified as Ni-Zn. Thickness of the IMCs layer increased whereas the growth rate decreased with time. It was found that the growth kinetic of the IMCs was diffusion control. A diffusion model was thus proposed to describe the diffusion behavior of Zn during long-term aging, which appeared to provide a good agreement with the microstructure evolution.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277008\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277008","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging
The diffusion behavior of Zn in Sn-8Zn-3Bi solder joints was investigated during long-time aging at 160 °C. Intermetallic compounds (IMCs) were formed at the interface, which were identified as Ni-Zn. Thickness of the IMCs layer increased whereas the growth rate decreased with time. It was found that the growth kinetic of the IMCs was diffusion control. A diffusion model was thus proposed to describe the diffusion behavior of Zn during long-term aging, which appeared to provide a good agreement with the microstructure evolution.
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