漂移弹性时基集成电阻传感器接口分析与建模

Jorge Marin, E. Sacco, Johan Vergauwen, G. Gielen
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引用次数: 3

摘要

本文介绍了集成电阻式传感器接口的漂移分析和改进,重点介绍了基于bbpl的架构。由于其时域和高度数字化的实现,该架构具有内在的弹性,可以抵抗由环境和电路退化效应产生的漂移。然而,对于以接近零漂移为目标的应用,由失配和非线性引起的非理想效应仍然会产生残余漂移。在非理想电路条件下研究了两种反馈机制。系统级分析和仿真预测了由环境变化和电路退化产生的主要非理想影响时的剩余输出误差。斩波技术作为一种漂移补偿机制被纳入分析。这种技术非常适合于单端桥,可以有效地消除漂移效应。结果表明,由于失配引起的漂移误差在满量程的±0.05%范围内衰减,与以前的出版物相比,相应的提高了10倍。
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Analysis and modeling of drift-resilient time-based integrated resistive sensor interfaces
This paper presents the drift analysis and improvement of integrated resistive sensor interfaces, focusing on BBPLL-based architectures. This architecture is intrinsically resilient to drift generated by environmental and circuit degradation effects due to its time-domain and highly-digital implementation. Nevertheless, for applications aiming at nearly zero drift, non-ideal effects resulting from mismatch and nonlinearity are still creating residual drift. Two proposed feedback mechanisms are studied under non-ideal circuit conditions. System-level analysis and simulations predict the remaining output error when the main non-ideal effects produced by environmental changes and circuit degradation occur. The chopping technique is included in the analysis as a drift-compensation mechanism. This technique fits well with a single-ended bridge to effectively remove drift effects. The results show that the drift error due to mismatch is attenuated within ±0.05% of the full scale, corresponding to a 10X improvement with respect to previous publications.
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