{"title":"集成光伏组件可靠性性能表征新方法","authors":"William R. Bottenberg","doi":"10.1109/IRPS.2013.6532012","DOIUrl":null,"url":null,"abstract":"This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.","PeriodicalId":138206,"journal":{"name":"2013 IEEE International Reliability Physics Symposium (IRPS)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Integration of new methods for photovoltaic module reliability performance characterization\",\"authors\":\"William R. Bottenberg\",\"doi\":\"10.1109/IRPS.2013.6532012\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.\",\"PeriodicalId\":138206,\"journal\":{\"name\":\"2013 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"87 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.2013.6532012\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2013.6532012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integration of new methods for photovoltaic module reliability performance characterization
This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.