集成光伏组件可靠性性能表征新方法

William R. Bottenberg
{"title":"集成光伏组件可靠性性能表征新方法","authors":"William R. Bottenberg","doi":"10.1109/IRPS.2013.6532012","DOIUrl":null,"url":null,"abstract":"This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.","PeriodicalId":138206,"journal":{"name":"2013 IEEE International Reliability Physics Symposium (IRPS)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Integration of new methods for photovoltaic module reliability performance characterization\",\"authors\":\"William R. Bottenberg\",\"doi\":\"10.1109/IRPS.2013.6532012\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.\",\"PeriodicalId\":138206,\"journal\":{\"name\":\"2013 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"87 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.2013.6532012\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2013.6532012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文描述了使用电致发光成像(EL),红外成像(IR)和模块遮光屏IV技术来表征模块中的单个电池性能,以帮助在新光伏(PV)模块设计可靠性测试期间进行故障分析(FA)。当与详细的建模集成到统一的方法中时,这些方法产生了一种更好的方法来理解在扩展压力测试或现场测试分析中出现的模块故障机制。这些技术需要快速评估和验证模块技术中的新材料和新结构。例子取自新的模块技术,如用于后接触电池模块的单片模块组装(MMA),以及导电粘合剂(ECA)和新型密封剂等新材料的使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Integration of new methods for photovoltaic module reliability performance characterization
This paper describes the use of electroluminescence imaging (EL), infra-red imaging (IR), and module shading screen IV techniques to characterize individual cell performance in modules to aid in failure analysis (FA) during the reliability testing of new photovoltaic (PV) module designs. When integrated with detailed modeling into a uniform approach these methods yield a superior approach to understanding failure mechanisms that arise in modules during extended stress testing or analysis from field testing. These techniques are required to quickly assess and validate new materials and new constructions in module technology. Examples are taken from new module technologies such as monolithic module assembly (MMA) for back contact cell modules as well as the use of new materials such as electrically conductive adhesives (ECA) and new encapsulants.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Resistor-less power-rail ESD clamp circuit with ultra-low leakage current in 65nm CMOS process An age-aware library for reliability simulation of digital ICs Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects Foundations for oxide breakdown compact modeling towards circuit-level simulations Making reliable memories in an unreliable world (invited)
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1