0.13μm集成电路中Al键垫织构对Ta/TaN双层势垒的依赖及其与光学反射率的关系

Lee Yuan Ping, R. R. Nistala, H. Younan, M. Bhat
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摘要

本文将介绍在不同的势垒金属衬底方案(Ta或Ta/TaN)上生长的铝薄膜晶体取向的依赖关系。Al晶粒的取向将显示出对材料特性的影响,从器件功能和可靠性的角度来看,这在IC制造中都是重要的。x射线粉末衍射研究表明,沉积在单个Ta层上的薄膜是随机取向的。另一方面,Ta/TaN双层衬底方案导致沿Al(111)的优选取向。建立了Al薄膜的晶粒取向与光学反射率之间的关系。此外,键垫的光学外观和键合性也受到Al晶粒取向的影响。
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Dependence of Texture in Al Bondpads on Ta/TaN Bilayer Barrier and its Correlation to Optical Reflectivity in 0.13μm IC Technology
In this paper, the dependence of crystallographic orientation in Aluminum thin films grown on different barrier-metal substrate schemes (Ta or Ta/TaN) will be presented. The orientation of Al grains will be shown to have a bearing on the material characteristics, which are important in IC fabrication from the perspective of both the device functionality and reliability. X-ray powder diffraction studies indicate that the films deposited on a single Ta layer are randomly oriented. On the other hand, a Ta/TaN bilayer substrate scheme results in preferred orientation along Al(111). A correlation will be established between the grain orientation and optical reflectivity properties of Al films. Moreover, the optical appearance of bondpads and their bondability are also influenced by the orientation of Al grains.
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