评估在最先进的功率封装中使用焊料贴片与环氧树脂贴片的影响

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI:10.1109/THERMINIC.2007.4451743

J. Czernohorsky, B. Maj, M. Viering, L. Wright, G. Balanon

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引用次数: 0

摘要

本文的主题是通过比较不同封装组件中带有多个热源的 ASIC，对环氧树脂（EDA）和焊接（SDA）芯片连接进行热研究。通过静态和瞬态热测量及模拟，研究了采用最先进 QFP 电源封装的两个样品的热行为，这两个样品仅在芯片连接材料（EDA 和 SDA）上存在差异。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).

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2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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