{"title":"用于CLICHÉ芯片上网络的高吞吐量架构","authors":"Mohamed A. Abd El-Ghany, M. El-Moursy, M. Ismail","doi":"10.1109/SOCCON.2009.5398069","DOIUrl":null,"url":null,"abstract":"High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.","PeriodicalId":303505,"journal":{"name":"2009 IEEE International SOC Conference (SOCC)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"High throughput architecture for CLICHÉ Network on Chip\",\"authors\":\"Mohamed A. Abd El-Ghany, M. El-Moursy, M. Ismail\",\"doi\":\"10.1109/SOCCON.2009.5398069\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.\",\"PeriodicalId\":303505,\"journal\":{\"name\":\"2009 IEEE International SOC Conference (SOCC)\",\"volume\":\"76 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International SOC Conference (SOCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOCCON.2009.5398069\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International SOC Conference (SOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCCON.2009.5398069","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High throughput architecture for CLICHÉ Network on Chip
High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.