用于CLICHÉ芯片上网络的高吞吐量架构

Mohamed A. Abd El-Ghany, M. El-Moursy, M. Ismail
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引用次数: 11

摘要

提出了实现高性能片上网络(NoC)的高吞吐量芯片级通信异构元件集成(CLICHÉ)体系结构。该架构将网络吞吐量提高了40%,同时保持了平均延迟。高吞吐量CLICHÉ开关的面积与CLICHÉ开关相比减少了18%。与实施CLICHÉ设计所需的总金属资源相比,实施高吞吐量CLICHÉ设计所需的总金属资源增加了7%。实现建议架构所需的额外功耗是CLICHÉ架构总功耗的8%。
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High throughput architecture for CLICHÉ Network on Chip
High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.
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