M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova
{"title":"无铅焊点可靠性试验","authors":"M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova","doi":"10.1109/ISSE.2012.6273133","DOIUrl":null,"url":null,"abstract":"For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability testing of lead-free solder joints\",\"authors\":\"M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova\",\"doi\":\"10.1109/ISSE.2012.6273133\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.\",\"PeriodicalId\":277579,\"journal\":{\"name\":\"2012 35th International Spring Seminar on Electronics Technology\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2012.6273133\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.
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