BGA MPI套接字分析和验证

F. Aldana, A. Zenteno, D. R. Mendavil, G. Regalado
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引用次数: 2

摘要

介绍了一种球栅阵列金属化粒子互连(BGA MPI)插座的设计。提出了一种新的静力系统设计方案,采用较小的力和元件来代替动态系统。在不同的压缩力作用下,MPI插座的力学性能表现为变形值,电气性能表现为S参数。MPI已在实验室通过连续性、阻力和验证试验进行验证。对套接字设计的所有测试均成功通过。
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BGA MPI socket analysis and validation
The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.
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