用于802.11b/g应用的1mm2倒装芯片SP3T开关和低噪声放大器RFIC FEM

C. Hale, R. Baeten
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引用次数: 3

摘要

本文提出了一种1mm2铜柱倒装芯片SP3T/LNA RFIC,用于802.11b/g前端。SP3T开关启用WLAN发送/接收和蓝牙操作模式。该开关每个分支的插入损耗为0.6dB,并提供高达+21dBm输出功率的802.11g线性性能。在WLAN Rx支路后连接bypass模式的单级LNA,以提高整体接收器灵敏度和动态范围。LNA实现1.9dB NF,典型的小信号增益为11.5dB,包括开关损耗。该芯片仅占现有类似QFN风格WLAN前端占地面积的25%。
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A 1mm2 flip-chip SP3T switch and low noise amplifier RFIC FEM for 802.11b/g applications
This paper presents a 1mm2 Cu pillar flip chip SP3T/LNA RFIC targeted for use in 802.11b/g front-ends. The SP3T switch enables WLAN transmit/receive and Bluetooth modes of operation. This switch exhibits 0.6dB insertion loss per branch and delivers 802.11g linear performance up to +21dBm output power. A single-stage LNA with a bypass mode is connected after the WLAN Rx branch to increase overall receiver sensitivity and dynamic range. The LNA achieved 1.9dB NF with a typical 11.5dB small-signal gain, including the switch loss. This die occupies only 25% of the footprint of similar existing QFN style WLAN front ends.
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