门控n/sup +/多晶硅场发射极阵列的制备与表征

H. Uh, S. Kwon, J. Lee, H. S. Park
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引用次数: 1

摘要

介绍了在绝缘层上制备的n/sup +/多晶硅场发射体的场发射特性,并与单晶硅场发射体进行了比较。制备的多晶硅发射体的SEM显微照片显示,由于在锐化氧化步骤中多晶硅的晶界与氧化物厚度的偏差导致结构均匀性差。在栅极偏置为82 V时,625个栅极孔直径为1.2 /spl mu/m的多晶硅晶尖和625个栅极孔直径为1.6 /spl mu/m的单晶硅晶尖分别测量了0.1 /spl mu/A/尖端的阳极电流。
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Fabrication and characterization of gated n/sup +/ polycrystalline silicon field emitter arrays
Field emission characteristics from n/sup +/ polycrystalline silicon (poly-Si) field emitters fabricated on an insulating layer are presented and compared with those from single crystal silicon field emitters. SEM micrographs of fabricated poly-Si emitters showed poor uniformity in structure due to the oxide thickness deviation associated with grain boundaries of poly-Si in sharpening oxidation step. The anode current of 0.1 /spl mu/A/tip was measured at the gate bias of 82 V from 625 poly-Si tips with gate hole diameter of 1.2 /spl mu/m and 80 V from 625 single crystal Si tips with diameter of 1.6 /spl mu/m, respectively.
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