M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen
{"title":"CPU封装冷却应用的高性能热润滑脂的评估","authors":"M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen","doi":"10.1109/STHERM.2005.1412157","DOIUrl":null,"url":null,"abstract":"High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Evaluation of high performance thermal greases for CPU package cooling applications\",\"authors\":\"M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen\",\"doi\":\"10.1109/STHERM.2005.1412157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"137 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of high performance thermal greases for CPU package cooling applications
High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.
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