可感知RLC耦合的片上总线联合编码

S. Rahaman, M. Chowdhury
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引用次数: 1

摘要

随着技术规模的扩大,电感串扰与电容串扰一起变得突出,并且在高速深亚微米和纳米级集成电路中造成了重大瓶颈。对于电感耦合,最坏延迟发生在所有母线同时向同一方向切换时。这种切换方式是电容式片上总线的最佳切换方式。因此,现有的各种电容串扰抑制编码技术都不适合高速电路,在高速电路中电磁效应不可忽视。本文针对RLC耦合感知的片上总线,提出了各种混合总线-逆变(BI)编码方法。仿真结果表明,电感主导母线的同时开关噪声(SSN)可以降低约40%,从而也降低了最坏情况下的耦合延迟。此外,提出了一种联合编码方法,以同时降低SSN并提高对深亚微米噪声误差的可靠性。
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Joint coding for RLC coupling-aware on-chip buses
As technology scales, inductive crosstalk becomes prominent along with capacitive crosstalk, and it is creating a significant bottleneck in high-speed deep sub-micron and nanoscale integrated circuits. For inductive coupling, worst-case delay occurs when all the bus lines simultaneously switch in the same direction. This switching case is the best case switching pattern for capacitive-dominant on-chip buses. Therefore, various existing coding techniques for capacitive crosstalk reduction are not suitable for high-speed circuits, where electromagnetic effect can not be ignored. In this paper, various hybrid bus-invert (BI) coding methods have been proposed for RLC coupling-aware on-chip buses. Simulation results show that simultaneous switching noise (SSN) for inductance-dominant buses can be reduced by roughly 40% and, thereby, worst case coupling delay is also reduced. Besides, a joint coding approach is proposed for simultaneous reduction of SSN and higher reliability to errors due to deep-submicron (DSM) noise.
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