Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

In this paper, the micro-polar theory is used to develop a numerical model for the prediction of the behavior of the material in the vicinity of the microsystem interconnection interface as well within the interface. This model, as compared with the classical continuum theory, can offer the possibility to include the size-effect for the simulation and prediction of the microsystem packaging interconnection materials. The model has been carried out in a finite element environment, and some examples are given as the application of the model.