电纺丝壳聚糖/掺银羟基磷灰石纳米纤维在不同烧结冷却速率下导热改性Si3N4陶瓷上的研究

M. Gürbüz, Pınar Uyan
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引用次数: 0

摘要

牙种植体暴露于循环载荷和热变化。牙科材料的热性能对于这些材料将在活组织中产生的生物变化非常重要。口腔的正常温度在32-37℃之间,而进食时,由于冷热食物,口腔温度可在0-80℃之间变化,导致创伤和种植体变质。氮化硅陶瓷具有惰性、高断裂韧性、高强度、高抗热震性和低密度等优点,是解决这些问题的良好选择。此外,Si3N4的表面修饰对于增强种植体与骨的相互作用也很重要。近年来,可生物降解的有机生物材料如ct (CTs)和掺银羟基磷灰石(HAPs)的组合物在提高氮化硅的有效性方面受到了极大的关注。在本研究中,MgO, SiO2和Y2O3的基体在牙科应用的烧结过程中具有快速和缓慢的冷却速度。采用静电纺丝法包覆ct /HAPs纤维,制备了改性的Si3N4衬底。采用XRD、SEM和激光闪蒸法对衬底和纺丝表面的晶体结构、微观结构和热扩散率进行了表征。结果表明,在烧结过程中,快速冷却Si3N4的密度(3.25g/cm3)和导热系数(46.35W/mK)高于缓慢冷却Si3N4的密度(3.22g/cm3和44.60 W/mK)。快速冷却的基体硬度和强度分别为1350 HV和1800 MPa,高于缓慢冷却的基体硬度和强度分别为1190 HV和1670 MPa。通过静电纺丝将CTs /HAPs纤维均匀沉积在快速冷却的Si3N4衬底表面,以开发表面功能。这种功能化基质可以作为牙科应用的候选材料。
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Electrospun Chitosan/Silver Doped-Hydroxyapatite Nano-Fibers on Thermal Conductivity Modified Si3N4 Ceramics with Different Sintering Cooling Rate
Dental implants are exposed to cycle loadings and thermal changes. The thermal properties of the materials in dentistry are important in terms of the biological changes that these materials will create in living tissues. The normal temperature of the oral cavity varies between 32-37℃, while eating, it can vary between 0-80℃ with hot-cold foods which led to the trauma and implant deteriorations. Si3N4 ceramic is a good candidate to solve these problems due to its inertness, high fracture toughness, strength, high thermal shock resistance and low density. Also, the surface modification of Si3N4 is important to enhance the interaction between the implant and bone. In recent years, biodegradable organic biomaterials as CTs (CTs) and silver doped hydroxyapatite (HAPs) combinations have a great attention to improve the Si3N4 effectiveness. In this study, MgO, SiO2, and Y2O3 included substrates were fabricated for fast and slow cooling rate during sintering in dental applications. CTs/HAPs fibers were coated with the electrospinning method to develop a modified Si3N4 substrate. The crystal structure, microstructure and thermal diffusivity measurement of the substrates and spun surfaces were characterized with XRD, SEM and Laser Flash Method. From the results, the higher density (3.25g/cm3) and thermal conductivity (46.35W/mK) for Si3N4 were observed for the fast cooling process during sintering compared with the slow cooling process (3.22g/cm3 and 44.60 W/mK). The hardness and strength of the fast cooled substrate were measured as 1350 HV and 1800 MPa which are greater than the slowly cooled samples (1190 HV, 1670 MPa). CTs /HAPs fibers are homogeneously deposited with electrospinning on the surface of the fast cooled Si3N4 substrate to develop the surface functionality. This functionalized substrate can be a candidate in dental applications.
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