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引用次数: 21

摘要

硅器件的特征尺寸接近价值,基本物理限制导致进一步缩放的投资回报递减,宽带隙半导体材料在许多应用中看起来越来越有吸引力,在这些应用中,高电子迁移率、高载流能力、高导热性、高温操作和高击穿场使它们优于硅和III-V半导体技术。基于氮化镓的器件已经证明了在高达300/spl℃的高温下很少或没有退化。AlGaN/GaN微波功率高电子迁移率晶体管(hemt)在10 GHz下的功率超过11 W/mm,取得了最引人注目的结果。在GaN/AlGaN异质界面或GaN/AlGaN量子阱结构中,二维电子气的最大密度可超过2/ sp1倍/10/sup 13/ cm/sup -2/,比传统的GaAs/AlGaAs异质结构高出一个数量级。氮化氮和氮化氮具有非常大的压电常数,可用于压电和热释电传感器,并可在传统电子器件中提高载流子浓度和减少漏电流。最近提出的应变能带工程和脉冲原子外延技术应该允许我们通过使用AlInGaN/GaN异质结构独立控制应变和晶格失配,并且应该在功率器件中找到重要的应用。SiO/ sub2 //AlGaInN/GaN金属氧化物半导体异质结构场效应晶体管(moshfet)和SiN/AlGaInN/GaN金属绝缘体半导体异质结构场效应晶体管(mishfet)表现出优于传统AlGaN/GaN器件的性能,并有望在电源应用中得到应用。GaN外延层可以在SiC上生长,这使我们能够将GaN的优越输运性能与SiC的高导热性结合起来。所有这些都给基于氮化镓的电子器件带来了希望,它们将与基于氮化镓的蓝光和白光以及紫外线发射器一样突出。
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Wide band gap electronic devices
The feature sizes of silicon devices approach values where fundamental physics limitations lead to diminishing returns on investment in further scaling, and wide band gap semiconductor materials look increasingly attractive for many applications, where high electron mobility, high current carrying capabilities, a high thermal conductivity, high temperature operation, and a high breakdown field make them superior to silicon and III-V semiconductor technology. GaN-based devices have demonstrated high-temperature operation with little or no degradation up to 300/spl deg/C. The most spectacular results have been obtained for AlGaN/GaN microwave power High Electron Mobility Transistors (HEMTs) that yielded over to 11 W/mm power at 10 GHz. The maximum density of the two-dimensional electron gas at the GaN/AlGaN heterointerface or in GaN/AlGaN quantum well structures can exceed 2/spl times/10/sup 13/ cm/sup -2/, which is an order of magnitude higher than for traditional GaAs/AlGaAs heterostructures. Very large piezoelectric constants of AlN and GaN can be used in piezoelectric and pyroelectric sensors and could be taken advantage for enhancing the sheet carrier concentration and reducing leakage current in conventional electronic devices. Recently proposed Strain Energy Band Engineering and Pulsed Atomic Epitaxy techniques should allow us to independently control strain and lattice mismatch by using AlInGaN/GaN heterostructures and should find important applications in power devices. SiO/sub 2//AlGaInN/GaN Metal Oxide Semiconductor Heterostructure Field Effect Transistors (MOSHFETs) and SiN/AlGaInN/GaN Metal Insulator Semiconductor Heterostructure Field Effect Transistors (MISHFETs) have exhibited performance superior to that of conventional AlGaN/GaN devices and hold promise for power applications. GaN epitaxial layers can be grown on SiC, which allows us to combine superior transport properties of GaN with a high thermal conductivity of SiC. All this gives hope that electronic devices based on GaN will reach the same prominence as GaN-based blue and white, and UV light emitters.
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