CPU引脚密度的研究及其应用

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI:10.1109/EMCSI.2018.8495252

Karen Navarro, R. Enriquez, A. Cueva, Clemens Thielen, B. Garcia, H. Peng

{"title":"CPU引脚密度的研究及其应用","authors":"Karen Navarro, R. Enriquez, A. Cueva, Clemens Thielen, B. Garcia, H. Peng","doi":"10.1109/EMCSI.2018.8495252","DOIUrl":null,"url":null,"abstract":"This work introduces 3 new patterns for efficient DDR interconnection. The patterns are optimized for implementation where the number of package pins is limited. For all cases, the industry specifications are fullfiled.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Study of CPU Pinout for Density and Its Application\",\"authors\":\"Karen Navarro, R. Enriquez, A. Cueva, Clemens Thielen, B. Garcia, H. Peng\",\"doi\":\"10.1109/EMCSI.2018.8495252\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work introduces 3 new patterns for efficient DDR interconnection. The patterns are optimized for implementation where the number of package pins is limited. For all cases, the industry specifications are fullfiled.\",\"PeriodicalId\":120342,\"journal\":{\"name\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495252\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了3种高效DDR互连的新模式。这些模式针对封装引脚数量有限的情况进行了优化。对于所有情况，行业规范都是完整的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

A Study of CPU Pinout for Density and Its Application

This work introduces 3 new patterns for efficient DDR interconnection. The patterns are optimized for implementation where the number of package pins is limited. For all cases, the industry specifications are fullfiled.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

自引率

0.00%

发文量

期刊最新文献

Characterization of the RFI Rectification Behavior of Instrumentation Amplifiers RFI Noise Source Quantification Based on Reciprocity Workshop - WED-PM-5 EMC for Home Appliances, Including Power Converters Applications Radiated Electric and Magnetic Field Emissions Shielding and Mitigations Emission Reduction by Optimizing Current Return Paths in Electric Vehicles