高温应用的SOI技术

P. Francis, A. Terao, B. Gentinne, D. Flandre, J. Colinge
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引用次数: 54

摘要

这项工作研究并证明了绝缘体上硅(SOI) mosfet在高温模拟和数字应用中的潜力。SOI/MOS器件中的小结面积比常规(大块)MOS器件减少了多达3到4个数量级的高温泄漏电流。阈值电压随温度的变化比批量器件小2到3倍,并且SOI mosfet的输出电导实际上随着温度的升高而提高。这些特性使数字和模拟SOI/CMOS电路的制造工作温度超过300摄氏度,性能几乎没有下降。本文介绍了小型SOI/CMOS电路块的高温性能,如静态和动态逻辑门、分频器和运算放大器
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SOI technology for high-temperature applications
This work investigates and demonstrates the potential of Silicon-On-Insulator (SOI) MOSFETs for high-temperature analog and digital applications. The small area of junctions in SOI/MOS devices reduces the high-temperature leakage currents by as much as 3 to 4 orders of magnitude over regular (bulk) MOS devices. The threshold voltage variation with temperature is 2 to 3 times smaller than in bulk devices, and the output conductance of SOI MOSFETs actually improves as temperature is increased. These properties enable the fabrication of digital and analog SOI/CMOS circuits operating up to over 300 degrees C with little performance degradation. This paper describes the high-temperature performances of small SOI/CMOS circuit blocks such as static and dynamic logic gates, frequency dividers, and operational amplifiers.<>
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