用晶格玻尔兹曼方法分析MEMS中挤压膜空气阻尼

Weilin Yang, Hongxia Li, Tiejun Zhang, A. Chatterjee, I. Elfadel
{"title":"用晶格玻尔兹曼方法分析MEMS中挤压膜空气阻尼","authors":"Weilin Yang, Hongxia Li, Tiejun Zhang, A. Chatterjee, I. Elfadel","doi":"10.1109/ITHERM.2016.7517593","DOIUrl":null,"url":null,"abstract":"Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Analysis of squeeze film air damping in MEMS with lattice Boltzmann method\",\"authors\":\"Weilin Yang, Hongxia Li, Tiejun Zhang, A. Chatterjee, I. Elfadel\",\"doi\":\"10.1109/ITHERM.2016.7517593\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.\",\"PeriodicalId\":426908,\"journal\":{\"name\":\"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2016.7517593\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517593","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

挤压膜空气阻尼对微机电装置的性能有重要影响。为了理解挤压膜阻尼机理,前人的研究采用了雷诺方程及其导数。实际上,Reynolds方程在量化MEMS特性时存在一定的局限性,因为其对小振幅和防滑边界条件的假设在实际应用中可能不被满足。应该考虑先进的建模方法来捕获详细的能量耗散物理。本文采用由经典玻尔兹曼输运方程导出的晶格玻尔兹曼方法研究了MEMS中挤压膜空气阻尼。我们的主要焦点是揭示空气膜是如何被梳子结构的侧面运动挤压的。考虑滑移和振幅效应,进行直接晶格玻尔兹曼模拟,得到Q因子。定量比较了造成能量损失的两种因素粘滞阻尼和弹性阻尼,揭示了其主要的阻尼机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Analysis of squeeze film air damping in MEMS with lattice Boltzmann method
Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Analytical model of graphene-enabled ultra-low power phase change memory ALN thin-films as heat spreaders in III–V photonics devices Part 2: Simulations Experimental study of bubble dynamics in highly wetting dielectric liquid pool boiling through high-speed video Condensate mobility actuated by microsurface topography and wettability modifications Inverse approach to characterize die-attach thermal interface of light emitting diodes
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1