M. Arifin, Nadhrah Wivanius, Nanta Fakih Prebianto
{"title":"环氧胶粘剂在半导体封装中的贴模材料研究进展","authors":"M. Arifin, Nadhrah Wivanius, Nanta Fakih Prebianto","doi":"10.1109/INCAE.2018.8579410","DOIUrl":null,"url":null,"abstract":"Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.","PeriodicalId":387859,"journal":{"name":"2018 International Conference on Applied Engineering (ICAE)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review\",\"authors\":\"M. Arifin, Nadhrah Wivanius, Nanta Fakih Prebianto\",\"doi\":\"10.1109/INCAE.2018.8579410\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.\",\"PeriodicalId\":387859,\"journal\":{\"name\":\"2018 International Conference on Applied Engineering (ICAE)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Conference on Applied Engineering (ICAE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INCAE.2018.8579410\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Applied Engineering (ICAE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INCAE.2018.8579410","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review
Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.