{"title":"温度感知的全局布局","authors":"B. Obermeier, F. Johannes","doi":"10.1109/ASPDAC.2004.1337555","DOIUrl":null,"url":null,"abstract":"We describe a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the quadratic placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened. Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.","PeriodicalId":426349,"journal":{"name":"ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-01-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":"{\"title\":\"Temperature-aware global placement\",\"authors\":\"B. Obermeier, F. Johannes\",\"doi\":\"10.1109/ASPDAC.2004.1337555\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We describe a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the quadratic placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened. Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.\",\"PeriodicalId\":426349,\"journal\":{\"name\":\"ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753)\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-01-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"55\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.2004.1337555\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASP-DAC 2004: Asia and South Pacific Design Automation Conference 2004 (IEEE Cat. No.04EX753)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2004.1337555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 55

摘要

我们描述了标准电池的确定性放置方法,该方法最大限度地减少了总功耗,并导致模具上的平滑温度分布。它是基于二次布局公式,其中总加权净长度是最小的。为实现上述目标,本文介绍了两项创新。首先,通过缩短网与高功耗最小化整体功耗。其次,单元分布在放置区域,使封装内的模具温度曲线变平。实验结果表明,该方法显著降低了模具上的最高温度,降低了总功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Temperature-aware global placement
We describe a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the quadratic placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened. Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Fixed-outline floorplanning through evolutionary search Optimal design of high fan-in multiplexers via mixed-integer nonlinear programming A V/sub DD/ and temperature independent CMOS voltage reference circuit Energy efficient code generation exploiting reduced bit-width instruction set architectures (rISA) Improvement of saturation characteristics of a frequency-demodulation CMOS image sensor
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1