系统交互问题的模块化结拓扑方法:仿真与验证

Phumin Kirawanich, James E. Thompson, N. Islam
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引用次数: 0

摘要

本文介绍了一种新的用于孔系统相互作用电磁兼容仿真的拓扑方案。该模拟方法通过引入模散射结作为波的传播路径,在不忽略后向散射相互作用的情况下,用一个模拟步骤代替了之前的多步计算过程。该方法还允许在子结构水平上进行修改,而无需模拟整个系统。采用传输线矩阵压缩法、时域有限差分法和互易定理等方法进行了模拟。由该概念生成的数值结果已通过实验结果得到验证,模拟数据与实验数据吻合较好。
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A modular junction topological approach to system interaction problems: simulation and validation
This paper introduces a new topological scheme for electromagnetic compatibility simulation for aperture-system interactions. By introducing modular scattering junctions as wave propagation paths, this simulation method substitutes the multi-step computational process presented earlier by a single simulation step without ignoring backscattering interactions. The method also allows for modifications in the sub-structural level without simulating the entire system. The simulations involve transmission line matrix compaction, finite-difference timedomain method, and reciprocity theorem to create different junctions. The numerical results generated by this concept have been validated through experimental results and there is a good agreement between the simulated and experimental data.
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