透射电镜细胞中HPM干扰对集成电路影响的研究

Xuelong Xu, Chunyong Han, E. Shao, Xianghong Lu, Wenxiao Fang, Rongquan Chen, Hengzhou Liu, Weiheng Shao, Yun-lei Shi
{"title":"透射电镜细胞中HPM干扰对集成电路影响的研究","authors":"Xuelong Xu, Chunyong Han, E. Shao, Xianghong Lu, Wenxiao Fang, Rongquan Chen, Hengzhou Liu, Weiheng Shao, Yun-lei Shi","doi":"10.1109/QR2MSE46217.2019.9021248","DOIUrl":null,"url":null,"abstract":"In this paper, HPM is used as the source of interference to affect the working state of an integrated circuit. The effect of the injected power and the orientation of the studied integrated circuit (FPGA) is investigated. In the experiment, it is found that the induced voltage of the I/O pin can reach 70.3 V under the electromagnetic field high to 1257.44 V/m. In spite of this, the working state of the FPGA remained normal.","PeriodicalId":233855,"journal":{"name":"2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Study of the HPM Interference Effect on Integrated Circuit in a TEM Cell\",\"authors\":\"Xuelong Xu, Chunyong Han, E. Shao, Xianghong Lu, Wenxiao Fang, Rongquan Chen, Hengzhou Liu, Weiheng Shao, Yun-lei Shi\",\"doi\":\"10.1109/QR2MSE46217.2019.9021248\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, HPM is used as the source of interference to affect the working state of an integrated circuit. The effect of the injected power and the orientation of the studied integrated circuit (FPGA) is investigated. In the experiment, it is found that the induced voltage of the I/O pin can reach 70.3 V under the electromagnetic field high to 1257.44 V/m. In spite of this, the working state of the FPGA remained normal.\",\"PeriodicalId\":233855,\"journal\":{\"name\":\"2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/QR2MSE46217.2019.9021248\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/QR2MSE46217.2019.9021248","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文将HPM作为干扰源,影响集成电路的工作状态。研究了注入功率和所研究的集成电路(FPGA)方向的影响。实验中发现,在高至1257.44 V/m的电磁场下,I/O引脚的感应电压可达70.3 V。尽管如此,FPGA的工作状态仍然正常。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Study of the HPM Interference Effect on Integrated Circuit in a TEM Cell
In this paper, HPM is used as the source of interference to affect the working state of an integrated circuit. The effect of the injected power and the orientation of the studied integrated circuit (FPGA) is investigated. In the experiment, it is found that the induced voltage of the I/O pin can reach 70.3 V under the electromagnetic field high to 1257.44 V/m. In spite of this, the working state of the FPGA remained normal.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Research on No-Failure Data Evaluation Method Based on Imported Failure Information A Rosenblatt Transformation Method Based on Copula Function for Solving Structural Reliability Muti-Obiective optimization and Reliability Analysis of Electrostatic Powder Spraying Machine Base Cumulative Analysis of Plastic Deformation of Curved Variable Thickness Cantilever Plate under Bending Load Thermal Fatigue Life of Copper-Filled Laminated Micropore Based on Response Surface Methodology
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1