三井技术对激光断层注入和激光传感器效率的影响

N. Borrel, C. Champeix, E. Kussener, W. Rahajandraibe, M. Lisart, A. Sarafianos, J. Dutertre
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引用次数: 3

摘要

这项研究是由于需要了解Deep-Nwell植入物对集成电路对激光诱导故障注入的灵敏度的影响。CMOS技术可以是双井或三井。与双井技术相比,三井技术在电气性能方面具有几个优势。双井中的单事件响应已经得到了广泛的研究,而三井中的单事件效应尚未得到很好的理解。本文对这两种技术在40 nm和90 nm CMOS工艺下的软误差率和对抗传感器进行了比较分析。首先,对寄存器上的激光故障注入进行了研究,表明三井技术更容易受到攻击。同样地,我们研究了两种技术的大块内置电流传感器(BBICS)在检测激光诱导故障注入尝试方面的效率。这种传感器在三井中效果较差。最后,为了提高检测效率,提出了一种适应身体偏置调整的BBICS。
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Influence of triple-well technology on laser fault injection and laser sensor efficiency
This study is driven by the need to understand the influence of a Deep-Nwell implant on the sensitivity of integrated circuits to laser-induced fault injections. CMOS technologies can be either dual-well or triple-well. Triple-well technology has several advantages compared to dual-well technology in terms of electrical performances. Single-event responses have been widely studied in dual-well whereas SEE (single event effects) in triple-well is not well understood. This paper presents a comparative analysis of soft error rate and countermeasures sensors with for these two techniques in 40 nm and 90 nm CMOS technology. First, laser fault injection on registers were investigated, showing that triple-well technology is more vulnerable. Similarly, we studied the efficiency of Bulk Built-In Current Sensors (BBICS) in detecting laser induced fault injection attempts for both techniques. This sensor was found less effective in triple-well. Finally, a new BBICS compliant with body-biasing adjustments is proposed in order to improve its detection efficiency.
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