SIO2/HFO2介电堆应力诱发漏电流来源的新认识

M. Rafik, G. Ribes, D. Roy, S. Kalpat, G. Ghibaudo
{"title":"SIO2/HFO2介电堆应力诱发漏电流来源的新认识","authors":"M. Rafik, G. Ribes, D. Roy, S. Kalpat, G. Ghibaudo","doi":"10.1109/IRWS.2006.305223","DOIUrl":null,"url":null,"abstract":"In this paper, stress induced leakage current under positive gate voltage is investigated. It turns out that it is caused by bulk defects that are also responsible for breakdown. Moreover, it appears that depending on the gate voltage, erroneous estimation could be made and could affect the conclusions on the reliability","PeriodicalId":199223,"journal":{"name":"2006 IEEE International Integrated Reliability Workshop Final Report","volume":"122 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"New Insight on the Origin of Stress Induced Leakage Current for SIO2/HFO2 Dielectric Stacks\",\"authors\":\"M. Rafik, G. Ribes, D. Roy, S. Kalpat, G. Ghibaudo\",\"doi\":\"10.1109/IRWS.2006.305223\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, stress induced leakage current under positive gate voltage is investigated. It turns out that it is caused by bulk defects that are also responsible for breakdown. Moreover, it appears that depending on the gate voltage, erroneous estimation could be made and could affect the conclusions on the reliability\",\"PeriodicalId\":199223,\"journal\":{\"name\":\"2006 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"122 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.2006.305223\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.2006.305223","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文研究了正栅极电压下的应力感应漏电流。事实证明,这是由大量缺陷引起的,这些缺陷也导致了故障。此外,根据栅极电压的不同,可能会产生错误的估计,从而影响对可靠性的结论
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New Insight on the Origin of Stress Induced Leakage Current for SIO2/HFO2 Dielectric Stacks
In this paper, stress induced leakage current under positive gate voltage is investigated. It turns out that it is caused by bulk defects that are also responsible for breakdown. Moreover, it appears that depending on the gate voltage, erroneous estimation could be made and could affect the conclusions on the reliability
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