一个150 GHz sub-0.1 μ m E/D MODFET MSI工艺

H. Rohdin, A. Nagy
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引用次数: 3

摘要

我们报道了一种利用传统光学接触光刻技术制造低于0.1 μ m栅极的方法,该方法利用了保形PECVD氧化物在欧姆接触之间形成的自限制缺口,以及RIE对氧化物的有限横向蚀刻。在氧化物中得到的栅极开口非常窄(约=700 AA),并且相当均匀(sigma >
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A 150 GHz sub-0.1- mu m E/D MODFET MSI process
We report a method for fabricating sub-0.1- mu m gates using conventional optical contact lithography, exploiting self-limiting notch formation in conformal PECVD oxide between ohmic contacts, and the limited lateral etch of oxide by RIE. The resulting gate openings in the oxide are very narrow ( approximately=700 AA), and quite uniform ( sigma <0.2x). 154 GHz current gain cutoff frequency has been extrapolated for a pseudomorphic InGaAs-channel E-MODFET made in this way. Functioning prescalers have been fabricated and characterized on-wafer.<>
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