{"title":"PCB现场及电路的电磁兼容分析","authors":"Aixin Chen, Li Wang, Xiangwei Ning, Yue Zhao","doi":"10.1109/EDAPS.2017.8276943","DOIUrl":null,"url":null,"abstract":"In this paper, electromagnetic compatibility (EMC) of a four-layer printed circuit board (PCB) with the function of Digital-to-Analog conversion (DAC) is analyzed. The characteristic is explored by the method of combination of field and circuit. Resonance of power layer is simulated in SIwave and noise of critical signal lines are simulated in Designer. Based on the result of simulation, some improvement approaches are put forward and applied to the PCB design. Finally, the DAC of the board has accomplished and the frequency spectrum of analog waveform is measured by network analyzer. The result of measurement shows a pure sine spectrum with noise lower than − 45dBm.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"EMC analysis on field and circuit of PCB\",\"authors\":\"Aixin Chen, Li Wang, Xiangwei Ning, Yue Zhao\",\"doi\":\"10.1109/EDAPS.2017.8276943\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, electromagnetic compatibility (EMC) of a four-layer printed circuit board (PCB) with the function of Digital-to-Analog conversion (DAC) is analyzed. The characteristic is explored by the method of combination of field and circuit. Resonance of power layer is simulated in SIwave and noise of critical signal lines are simulated in Designer. Based on the result of simulation, some improvement approaches are put forward and applied to the PCB design. Finally, the DAC of the board has accomplished and the frequency spectrum of analog waveform is measured by network analyzer. The result of measurement shows a pure sine spectrum with noise lower than − 45dBm.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8276943\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8276943","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this paper, electromagnetic compatibility (EMC) of a four-layer printed circuit board (PCB) with the function of Digital-to-Analog conversion (DAC) is analyzed. The characteristic is explored by the method of combination of field and circuit. Resonance of power layer is simulated in SIwave and noise of critical signal lines are simulated in Designer. Based on the result of simulation, some improvement approaches are put forward and applied to the PCB design. Finally, the DAC of the board has accomplished and the frequency spectrum of analog waveform is measured by network analyzer. The result of measurement shows a pure sine spectrum with noise lower than − 45dBm.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
