高性能MoS2 n沟道mosfet

Xiwen Liu, Zichao Ma, M. Chan, W. Liao, Lining Zhang
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引用次数: 0

摘要

在本文中,我们展示了具有钪(Sc)触点和高k ZrO2介电体的高性能背控MoS2 mosfet,以改善接触电阻和电子迁移率。在ZrO2/Si衬底上,1µm沟道长度的多层MoS2 mosfet实现了200µA/µm的漏极电流记录。低功函数金属Sc在源区具有强门控效应的剥落二硫化钼上的本征接触电阻显著降低至0.9 kΩ·µm。考虑到接触电阻的影响,Y函数技术提取的本禀迁移率为132 cm2/Vs,比SiO2衬底高3倍,这是由于高k ZrO2介质对杂质散射有明显的屏蔽作用。
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High Performance MoS2 N-Channel MOSFETs
In this paper, we have demonstrated high performance back-gated MoS2 MOSFETs with scandium (Sc) contact and high-k ZrO2 dielectrics for improved contact resistance and electron mobility. Record drain current of 200 µA/µm has been achieved for 1-µm channel length multilayer MoS2 MOSFETs on ZrO2/Si substrates. The intrinsic contact resistance of low work function metal Sc on exfoliated MoS2 with strong gating effect on source region is significantly decreased to 0.9 kΩ·µm. By taking the impact of contact resistance into consideration, the intrinsic mobility extracted from Y function technique is 132 cm2/Vs, 3 times higher than SiO2 substrate, originating from the significant screening effect of high-k ZrO2 dielectrics on the impurity scattering.
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