在击穿电场接近理论极限的硅衬底上的千伏GaN MOSHEMT

M. Tao, Maojun Wang, C. Wen, Jinyan Wang, Y. Hao, Wengang Wu, K. Cheng, B. Shen
{"title":"在击穿电场接近理论极限的硅衬底上的千伏GaN MOSHEMT","authors":"M. Tao, Maojun Wang, C. Wen, Jinyan Wang, Y. Hao, Wengang Wu, K. Cheng, B. Shen","doi":"10.23919/ISPSD.2017.7988901","DOIUrl":null,"url":null,"abstract":"This work reports a kilovolt and low current collapse normally-off GaN MOSHEMT on silicon substrate. The device with a drift length of 3 μm features a threshold voltage of 1.7 V and an output current of 430 mA/mm at 8 V gate bias. The off-state breakdown voltage (BV) is as high as 1021 V (800 V) defined at a drain leakage criterion of 10 μA/mm with floating (grounded) substrate. The corresponding breakdown electric field is 3.4 MV/cm and the Baliga's figure-of-merit (BFOM) is 1.6 GW/cm2. A small degradation of the dynamic on-resistance (Ron, d) about 30% is observed with a short pulse width of 500 ns and a quiescent drain bias of 60 V. The record value is supposed to benefit from the intrinsic step-graded field plate, high quality LPCVD SÌ3N4 passivation and material optimization of 4.5 μm thick epitaxial layer.","PeriodicalId":202561,"journal":{"name":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Kilovolt GaN MOSHEMT on silicon substrate with breakdown electric field close to the theoretical limit\",\"authors\":\"M. Tao, Maojun Wang, C. Wen, Jinyan Wang, Y. Hao, Wengang Wu, K. Cheng, B. Shen\",\"doi\":\"10.23919/ISPSD.2017.7988901\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work reports a kilovolt and low current collapse normally-off GaN MOSHEMT on silicon substrate. The device with a drift length of 3 μm features a threshold voltage of 1.7 V and an output current of 430 mA/mm at 8 V gate bias. The off-state breakdown voltage (BV) is as high as 1021 V (800 V) defined at a drain leakage criterion of 10 μA/mm with floating (grounded) substrate. The corresponding breakdown electric field is 3.4 MV/cm and the Baliga's figure-of-merit (BFOM) is 1.6 GW/cm2. A small degradation of the dynamic on-resistance (Ron, d) about 30% is observed with a short pulse width of 500 ns and a quiescent drain bias of 60 V. The record value is supposed to benefit from the intrinsic step-graded field plate, high quality LPCVD SÌ3N4 passivation and material optimization of 4.5 μm thick epitaxial layer.\",\"PeriodicalId\":202561,\"journal\":{\"name\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ISPSD.2017.7988901\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ISPSD.2017.7988901","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

本工作报道了在硅衬底上的千伏低电流坍塌GaN MOSHEMT。该器件漂移长度为3 μm,阈值电压为1.7 V,栅极偏置为8 V时输出电流为430 mA/mm。在浮动(接地)衬底漏极漏电标准为10 μA/mm时,断态击穿电压(BV)可高达1021 V (800v)。相应的击穿电场为3.4 MV/cm, Baliga的优值(bbfm)为1.6 GW/cm2。在500 ns的短脉冲宽度和60 V的静态漏极偏压下,观察到动态导通电阻(Ron, d)下降了约30%。本征阶跃梯度场板、高质量的LPCVD SÌ3N4钝化和4.5 μm厚外延层的材料优化等因素都有助于实现这一记录值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Kilovolt GaN MOSHEMT on silicon substrate with breakdown electric field close to the theoretical limit
This work reports a kilovolt and low current collapse normally-off GaN MOSHEMT on silicon substrate. The device with a drift length of 3 μm features a threshold voltage of 1.7 V and an output current of 430 mA/mm at 8 V gate bias. The off-state breakdown voltage (BV) is as high as 1021 V (800 V) defined at a drain leakage criterion of 10 μA/mm with floating (grounded) substrate. The corresponding breakdown electric field is 3.4 MV/cm and the Baliga's figure-of-merit (BFOM) is 1.6 GW/cm2. A small degradation of the dynamic on-resistance (Ron, d) about 30% is observed with a short pulse width of 500 ns and a quiescent drain bias of 60 V. The record value is supposed to benefit from the intrinsic step-graded field plate, high quality LPCVD SÌ3N4 passivation and material optimization of 4.5 μm thick epitaxial layer.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Message from the general chair Pressure contact multi-chip packaging of SiC Schottky diodes Experimental study of the short-circuit performance for a 600V normally-off p-gate GaN HEMT Design considerations of vertical GaN nanowire Schottky barrier diodes Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1