Research on Signal Integrity of UWB BGA Differential Transmission Structure Based on HiTCE

This article introduces a BGA differential signal transmission structure based on HiTCE multilayer co-fired ceramic technology. The application frequency range is from DC to V band, which is suitable for system-in-package of millimeter wave chips. The research content includes the design and modeling of the differential signal transmission structure, the impedance matching and optimization of the transmission path, and the signal integrity simulation and analysis of the differential signal transmission structure. The transmission structure includes an upper substrate and a lower substrate made of HiTCE materials. The upper differential transmission line and the lower differential transmission line are connected by solder balls. The signal integrity is characterized by the scattering parameters tested by the vector network analyzer and the eye pattern displayed by the oscilloscope. The test and simulation have good consistency, and meet the design of processing. From $\mathbf{DC}\sim 60\mathbf{GHz}$, the return loss of the differential transmission structure is better than 10dB, and the insertion loss is better than 1dB.