3.3 tb /s紧凑光纤封装,采用预制光纤

Rika Nomura, N. Chujo, Akiko Mizushima, N. Matsushima, Kouichi Fukumiya, Itoe Akutsu, Koji Hata
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引用次数: 0

摘要

我们开发了一种用于信息通信技术中机架到机架传输的紧凑型光纤封装。采用预成型光纤代替光纤束和带状光纤,减少了光纤的布线面积和保护。我们制作了一个带有光模块的原型模型板,实现了3.3 Tb/s的带宽和4500 mm2的面积。我们证实了在25gb /s (PRBS: 231-1)的5米光缆的板对板传输性能良好。
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3.3-Tb/s compact optical fiber package using pre-formed optical fiber
We developed a compact optical fiber package for rack-to-rack transmission in information communication technology. Using pre-formed optical fiber instead of optical fiber strands and ribbon fiber, we achieved a reduction in the routing area and protection of the optical fiber. We fabricated a prototype mock-up board with optical modules and achieved a bandwidth of 3.3 Tb/s and an area of 4500 mm2. We confirmed a good transmission performance board-to-board with 5 m of optical cable at 25 Gb/s (PRBS: 231-1).
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