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引用次数: 2
摘要
通过升级现有机柜中的处理器，从而增加处理器的功率包络度的案例研究，展示了开发热解决方案的方法。本文以基于UltraSparc IV (USIV)的Sun Fire E25K服务器为例。这台高端服务器使用了与上一代Sun Fire 15K服务器相同的物理配置，可容纳72个UltraSparc III (USIII)处理器。为了表征Sun Fire 15K的热性能，进行了大量的实验研究，包括机柜级、板级、CPU风冷散热器和风扇/风扇托盘的热特性。将实验数据与流网络模型、验证的解析方法和数值模拟相结合，提出了解决方案。解决方案包括一个新的CPU散热器设计和优化气流在板和机柜级。提出的解决方案在现有产品中得到验证，并在新产品中成功实现。
Thermal solution development for high-end server systems
A methodology to develop a thermal solution was demonstrated through a case study of upgrading processors in an existing cabinet, thereby increasing the power envelope of the processors. The Sun Fire E25K server, based on UltraSparc IV (USIV), was used as an example in this paper. This high-end server utilized the same physical configuration as in the preceding generation Sun Fire 15K server accommodating seventy-two UltraSparc III (USIII) processors. Extensive experimental investigations have been carried out to characterize the thermal performance in the Sun Fire 15K including cabinet-level, board-level, CPU air-cooled heat sink, and fan/fan tray thermal characterization. Solutions were proposed by combining the experimental data with flow network modeling, validated analytical methods and numerical modeling. Solutions included a new CPU heat sink design and air flow optimization at the board and cabinet level. The proposed solutions were verified in the existing product and successfully implemented in the new product.
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