分层测试方法采用边界扫描测试

M. Hasan, M. U. Siddiqi
{"title":"分层测试方法采用边界扫描测试","authors":"M. Hasan, M. U. Siddiqi","doi":"10.1109/SMELEC.2000.932475","DOIUrl":null,"url":null,"abstract":"With integration and miniaturization of electronic components, physical access to the boundary of the components on a printed circuit board or system is almost impossible. The IEEE 1149.1 and the boundary scan test have evolved to meet this challenge by electronically accessing the component boundary. In this paper, application of boundary scan test techniques at different levels of digital systems is discussed. Test generation for different interconnection faults on printed circuit boards and test application through the standard test access port is considered. Acceptance and potential capabilities of the method are presented.","PeriodicalId":359114,"journal":{"name":"ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Hierarchical test approach using boundary scan test\",\"authors\":\"M. Hasan, M. U. Siddiqi\",\"doi\":\"10.1109/SMELEC.2000.932475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With integration and miniaturization of electronic components, physical access to the boundary of the components on a printed circuit board or system is almost impossible. The IEEE 1149.1 and the boundary scan test have evolved to meet this challenge by electronically accessing the component boundary. In this paper, application of boundary scan test techniques at different levels of digital systems is discussed. Test generation for different interconnection faults on printed circuit boards and test application through the standard test access port is considered. Acceptance and potential capabilities of the method are presented.\",\"PeriodicalId\":359114,\"journal\":{\"name\":\"ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2000.932475\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2000.932475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

随着电子元件的集成化和小型化,在印刷电路板或系统上对元件边界的物理访问几乎是不可能的。IEEE 1149.1和边界扫描测试已经通过电子访问组件边界来应对这一挑战。本文讨论了边界扫描测试技术在不同层次数字系统中的应用。考虑了印制电路板上不同互连故障的测试生成和通过标准测试接入端口的测试应用。介绍了该方法的可接受性和潜在能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Hierarchical test approach using boundary scan test
With integration and miniaturization of electronic components, physical access to the boundary of the components on a printed circuit board or system is almost impossible. The IEEE 1149.1 and the boundary scan test have evolved to meet this challenge by electronically accessing the component boundary. In this paper, application of boundary scan test techniques at different levels of digital systems is discussed. Test generation for different interconnection faults on printed circuit boards and test application through the standard test access port is considered. Acceptance and potential capabilities of the method are presented.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Failure analysis and elimination of poly residues contamination in wafer fabrication Correlation of silicon wafer strength to the surface morphology Optical sensing of tea aroma using n-tetraphenyl porphine manganese (III) chloride thin films An efficient architecture of 8-bit CMOS analog-to-digital converter The saturation effect of etch depth at high RF power in CF/sub 4/ plasma RIE silicon etching
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1